专利名称：High-impedance substrate, antenna device
and mobile radio device
发明人：Makoto Higaki,Kazuhiro Inoue,Shuichi
Sekine,Akihiro Tsujimura
申请号：US11950525申请日：20071205公开号：US07623087B2公开日：20091124
专利附图：
摘要：There is provided with a high-impedance substrate including: a finite groundplane; a plurality of metal plates arranged at a predetermined height from the finite
ground plane and in a matrix pattern such that respective faces thereof are
approximately parallel to the finite ground plane; and a plurality of linear conductiveelements configured to connect the plurality of metal plates to the finite ground planeand, wherein outer metal plates arranged at an outermost periphery among the pluralityof metal plates are connected with the linear conductive elements at edges of the outermetal plates.
申请人：Makoto Higaki,Kazuhiro Inoue,Shuichi Sekine,Akihiro Tsujimura
地址：Kawasaki JP,Inagi JP,Yokohama JP,Ome JP
国籍：JP,JP,JP,JP
代理机构：Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容